Software R&D Engineer (3009144)
薪資範圍:1,500,000 ~ 1,800,000 TWD / year
產業類別： 其它半導體相關
職責要求
• Collaborate with the engineering team to develop new features, diagnose root causes, and provide technical support to both the product line and field service teams.
• Further standardization of the components used between different module platforms.
• Process improvements and quality mindset in design perspective in order to secure production output and deal with customer issue escalation.
• Having risk assessments (FMEA) in issue investigation and test planning capability
• Software package/patch version control and provide release notes to stakeholders
• Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) according to internal/external customer’s requests.
• Responsible for solution delivery and commitment on project timelines.
• Teamwork: Able to work in a cross function and international environment.
• Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge.
• Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement.
• Planning: Result oriented thoughts for assigned task and project.
公司地址:
台北市南京東路五段99號7樓其他:
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